CVE-2024-53024
CVE-2024-53024 is a high-severity vulnerability in Qualcomm Qcs6490 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-476.
Key facts
- Severity: High (CVSS 3.x base score 7.8)
- EPSS exploit prediction: 0% (2nd percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2025-5795
- Weakness: CWE-476
- Affected product: Qualcomm Qcs6490 Firmware
- Published:
- Last modified:
Description
Memory corruption in display driver while detaching a device.
Frequently asked questions
- What is CVE-2024-53024?
- Memory corruption in display driver while detaching a device.
- How severe is CVE-2024-53024?
- CVE-2024-53024 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2024-53024 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (2nd percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2024-53024?
- CVE-2024-53024 primarily affects Qualcomm Qcs6490 Firmware. In total, 166 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2024-53024?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- Does CVE-2024-53024 have an EU (EUVD) identifier?
- Yes. CVE-2024-53024 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-5795.
- When was CVE-2024-53024 published?
- CVE-2024-53024 was published on 2025-03-03 and last updated on 2026-06-17.
References
Affected products (166)
- cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs7230_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8300_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs9100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qmp1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qsm8350_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc5_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:robotics_rb2_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:robotics_rb5_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8530p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8540p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8620p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8650p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8770p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx61_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sg8275p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4635_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Qcs6490 Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2023-22388 — Critical (CVSS 9.8): Memory Corruption in Multi-mode Call Processor while processing bit mask API.
- CVE-2023-33028 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while doing a memory copy of pmk cache.
- CVE-2023-24855 — Critical (CVSS 9.8): Memory corruption in Modem while processing security related configuration before AS Security Exchange.
All CVEs affecting Qualcomm Qcs6490 Firmware →
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Browse all CWE-476 (NULL Pointer Dereference) vulnerabilities →