How severe is CVE-2025-21467?

CVE-2025-21467 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2025-21467 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2025-21467?

CVE-2025-21467 primarily affects Qualcomm Csra6620 Firmware. In total, 106 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2025-21467?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

Does CVE-2025-21467 have an EU (EUVD) identifier?

Yes. CVE-2025-21467 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-13522.

When was CVE-2025-21467 published?

CVE-2025-21467 was published on 2025-05-06 and last updated on 2026-06-17.

CVE-2025-21467

CVE-2025-21467 is a high-severity vulnerability in Qualcomm Csra6620 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-787.

Key facts

Severity: High (CVSS 3.x base score 7.8)
EPSS exploit prediction: 0% (1st percentile)
Actively exploited: Not listed in CISA KEV
EU (EUVD) id: EUVD-2025-13522
Weakness: CWE-787
Affected product: Qualcomm Csra6620 Firmware
Published: 2025-05-06
Last modified: 2026-06-17

Description

Memory corruption while reading the FW response from the shared queue.

Frequently asked questions

What is CVE-2025-21467?: Memory corruption while reading the FW response from the shared queue.
How severe is CVE-2025-21467?: CVE-2025-21467 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2025-21467 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2025-21467?: CVE-2025-21467 primarily affects Qualcomm Csra6620 Firmware. In total, 106 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2025-21467?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
Does CVE-2025-21467 have an EU (EUVD) identifier?: Yes. CVE-2025-21467 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-13522.
When was CVE-2025-21467 published?: CVE-2025-21467 was published on 2025-05-06 and last updated on 2026-06-17.

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html

Affected products (106)

cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm4125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:smart_audio_400_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_460_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_660_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_662_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_690_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_750g_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_765_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_765g_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_768g_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8\+_gen_1_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_888_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_888\+_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_wearable_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x12_lte_modem_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_xr2_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_xr2\+_gen_1_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr2230p_firmware:-:*:*:*:*:*:*:*

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