CVE-2025-27070
CVE-2025-27070 is a high-severity vulnerability in Qualcomm Qcs615 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-787.
Key facts
- Severity: High (CVSS 3.x base score 7.8)
- EPSS exploit prediction: 0% (1st percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2025-37620
- Weakness: CWE-787
- Affected product: Qualcomm Qcs615 Firmware
- Published:
- Last modified:
Description
Memory corruption while performing encryption and decryption commands.
Frequently asked questions
- What is CVE-2025-27070?
- Memory corruption while performing encryption and decryption commands.
- How severe is CVE-2025-27070?
- CVE-2025-27070 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2025-27070 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2025-27070?
- CVE-2025-27070 primarily affects Qualcomm Qcs615 Firmware. In total, 175 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2025-27070?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- Does CVE-2025-27070 have an EU (EUVD) identifier?
- Yes. CVE-2025-27070 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-37620.
- When was CVE-2025-27070 published?
- CVE-2025-27070 was published on 2025-11-04 and last updated on 2026-06-17.
References
Affected products (175)
- cpe:2.3:o:qualcomm:qcs615_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8300_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs9100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdu1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdu1010_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdu1110_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdu1210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdx1010_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdx1011_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qep8111_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qfw7114_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qfw7124_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qmp1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qru1032_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qru1052_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qru1062_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qsm8350_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa4150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa4155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8530p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8540p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8620p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8650p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8770p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Qcs615 Firmware
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2025-47345 — High (CVSS 8.4): Cryptographic issue may occur while encrypting license data.
- CVE-2025-21487 — High (CVSS 8.2): Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is…
- CVE-2025-21427 — High (CVSS 8.2): Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.
- CVE-2024-53026 — High (CVSS 8.2): Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call.
All CVEs affecting Qualcomm Qcs615 Firmware →
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