CVE-2025-59617
CVE-2025-59617 is a medium-severity vulnerability in Qualcomm Fastconnect 6700 Firmware with a CVSS 3.x base score of 6.6. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-416.
Key facts
- Severity: Medium (CVSS 3.x base score 6.6)
- EPSS exploit prediction: 0% (1st percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-416
- Affected product: Qualcomm Fastconnect 6700 Firmware
- Published:
- Last modified:
Description
Memory Corruption when processing multiple IOCTL calls with the same buffer file descriptor input.
Frequently asked questions
- What is CVE-2025-59617?
- Memory Corruption when processing multiple IOCTL calls with the same buffer file descriptor input.
- How severe is CVE-2025-59617?
- CVE-2025-59617 has a CVSS 3.x base score of 6.6, rated medium severity. It is exploitable over local access with high attack complexity, requires low privileges and user interaction. Impact on confidentiality is low, integrity high, and availability low.
- Is CVE-2025-59617 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2025-59617?
- CVE-2025-59617 primarily affects Qualcomm Fastconnect 6700 Firmware. In total, 48 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2025-59617?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
- When was CVE-2025-59617 published?
- CVE-2025-59617 was published on 2026-07-06 and last updated on 2026-07-07.
References
Affected products (48)
- cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:molokai_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:orne_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:pandeiro_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm5430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qmp1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qmp2001_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8380xp_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8845p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_662_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_elite_gen_5_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_ar1_gen_1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2\+_gen_1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2230p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9378_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9395_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7760_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7860_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7861_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7880_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7881_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Fastconnect 6700 Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2023-28582 — Critical (CVSS 9.8): Memory corruption in Data Modem while verifying hello-verify message during the DTLS handshake.
- CVE-2023-33025 — Critical (CVSS 9.8): Memory corruption in Data Modem when a non-standard SDP body, during a VOLTE call.
- CVE-2023-22388 — Critical (CVSS 9.8): Memory Corruption in Multi-mode Call Processor while processing bit mask API.
All CVEs affecting Qualcomm Fastconnect 6700 Firmware →
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