CVE-2026-21383
CVE-2026-21383 is a high-severity vulnerability in Qualcomm Fastconnect 6900 Firmware with a CVSS 3.x base score of 7.1. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-323.
Key facts
- Severity: High (CVSS 3.x base score 7.1)
- EPSS exploit prediction: 0% (1st percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-323
- Affected product: Qualcomm Fastconnect 6900 Firmware
- Published:
- Last modified:
Description
Cryptographic Issue when using a static initialization vector for AES-GCM key wrapping, which requires a unique value for each call to ensure security.
Frequently asked questions
- What is CVE-2026-21383?
- Cryptographic Issue when using a static initialization vector for AES-GCM key wrapping, which requires a unique value for each call to ensure security.
- How severe is CVE-2026-21383?
- CVE-2026-21383 has a CVSS 3.x base score of 7.1, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability none.
- Is CVE-2026-21383 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2026-21383?
- CVE-2026-21383 primarily affects Qualcomm Fastconnect 6900 Firmware. In total, 53 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2026-21383?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- When was CVE-2026-21383 published?
- CVE-2026-21383 was published on 2026-07-06 and last updated on 2026-07-08.
References
Affected products (53)
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:lemans_au_lgit_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:lemansau_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:pandeiro_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8397p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8797p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qamsrv1h_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qamsrv1m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6797aq_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8695au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdu1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdu1110_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdu1210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdx1010_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qdx1011_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qln1083bd_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qln1086bd_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qpa1083bd_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qpa1086bd_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qualcomm_dragonwing_x100_accelerator_card_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qxm1093_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qxm1094_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qxm1095_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qxm1096_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8620p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8770p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sar1165p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sar2130p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_ar1_gen_1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_ar1\+_gen_1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:srv1h_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Fastconnect 6900 Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2024-21473 — Critical (CVSS 9.8): Memory corruption while redirecting log file to any file location with any file name.
- CVE-2023-43553 — Critical (CVSS 9.8): Memory corruption while parsing beacon/probe response frame when AP sends more supported links in MLIE.
- CVE-2023-43552 — Critical (CVSS 9.8): Memory corruption while processing MBSSID beacon containing several subelement IE.
All CVEs affecting Qualcomm Fastconnect 6900 Firmware →
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