How severe is CVE-2026-21385?

CVE-2026-21385 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2026-21385 being actively exploited?

Yes. CVE-2026-21385 is on CISA's Known Exploited Vulnerabilities (KEV) catalog, added on 2026-03-03, which means active exploitation has been confirmed. It should be prioritised for remediation.

What products are affected by CVE-2026-21385?

CVE-2026-21385 primarily affects Qualcomm Sm7675p Firmware. In total, 237 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2026-21385?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Because this CVE is known to be actively exploited, treat remediation as urgent — CISA KEV typically sets a short remediation deadline.

Does CVE-2026-21385 have an EU (EUVD) identifier?

Yes. CVE-2026-21385 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2026-9202. It is also flagged as exploited in the EUVD (since 2026-03-03).

When was CVE-2026-21385 published?

CVE-2026-21385 was published on 2026-03-02 and last updated on 2026-06-17.

CVE-2026-21385

CVE-2026-21385 is a high-severity vulnerability in Qualcomm Sm7675p Firmware with a CVSS 3.x base score of 7.8. It is listed in CISA's Known Exploited Vulnerabilities (KEV) catalog, confirming it has been exploited in the wild (added 2026-03-03). The underlying weakness is classified as CWE-190.

Key facts

Severity: High (CVSS 3.x base score 7.8)
EPSS exploit prediction: 1% (61st percentile)
Actively exploited: Yes — listed in CISA KEV (added 2026-03-03)
EU (EUVD) id: EUVD-2026-9202
EU exploitation: Flagged exploited in the ENISA EU Vulnerability Database (since 2026-03-03)
Weakness: CWE-190
Affected product: Qualcomm Sm7675p Firmware
Published: 2026-03-02
Last modified: 2026-06-17

Description

Memory corruption while using alignments for memory allocation.

Frequently asked questions

What is CVE-2026-21385?: Memory corruption while using alignments for memory allocation.
How severe is CVE-2026-21385?: CVE-2026-21385 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2026-21385 being actively exploited?: Yes. CVE-2026-21385 is on CISA's Known Exploited Vulnerabilities (KEV) catalog, added on 2026-03-03, which means active exploitation has been confirmed. It should be prioritised for remediation.
What products are affected by CVE-2026-21385?: CVE-2026-21385 primarily affects Qualcomm Sm7675p Firmware. In total, 237 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2026-21385?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Because this CVE is known to be actively exploited, treat remediation as urgent — CISA KEV typically sets a short remediation deadline.
Does CVE-2026-21385 have an EU (EUVD) identifier?: Yes. CVE-2026-21385 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2026-9202. It is also flagged as exploited in the EUVD (since 2026-03-03).
When was CVE-2026-21385 published?: CVE-2026-21385 was published on 2026-03-02 and last updated on 2026-06-17.

References

Affected products (237)

cpe:2.3:o:qualcomm:sm7675p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8475p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8635_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8635p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8650q_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:smart_audio_400_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:smart_display_200_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_4_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_4_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_429_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_480\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_480_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_6_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_6_gen_3_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_6_gen_4_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_625_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_626_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_660_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_662_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_690_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_695_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_7\+_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_7_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_778g\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_778g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_782g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_7c\+_gen_3_compute_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_7s_gen_3_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8\+_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8\+_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_elite_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_elite_gen_5_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_platform_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Sm7675p Firmware

CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
CVE-2025-21450 — Critical (CVSS 9.1): Cryptographic issue occurs due to use of insecure connection method while downloading.
CVE-2025-47392 — High (CVSS 8.8): Memory corruption when decoding corrupted satellite data files with invalid signature offsets.
CVE-2025-21479 — High (CVSS 8.6): Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.

All CVEs affecting Qualcomm Sm7675p Firmware →

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