How severe is CVE-2026-24090?

CVE-2026-24090 has a CVSS 3.x base score of 7.1, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability none.

Is CVE-2026-24090 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2026-24090?

CVE-2026-24090 primarily affects Qualcomm Snapdragon 460 Mobile Platform Firmware. In total, 217 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2026-24090?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

Does CVE-2026-24090 have an EU (EUVD) identifier?

Yes. CVE-2026-24090 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2026-33847.

When was CVE-2026-24090 published?

CVE-2026-24090 was published on 2026-06-01 and last updated on 2026-06-17.

CVE-2026-24090

CVE-2026-24090 is a high-severity vulnerability in Qualcomm Snapdragon 460 Mobile Platform Firmware with a CVSS 3.x base score of 7.1. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-306.

Key facts

Severity: High (CVSS 3.x base score 7.1)
EPSS exploit prediction: 0% (1st percentile)
Actively exploited: Not listed in CISA KEV
EU (EUVD) id: EUVD-2026-33847
Weakness: CWE-306
Affected product: Qualcomm Snapdragon 460 Mobile Platform Firmware
Published: 2026-06-01
Last modified: 2026-06-17

Description

Cryptographic issue while processing partition table entries allows unauthorized modification of boot flow.

Frequently asked questions

What is CVE-2026-24090?: Cryptographic issue while processing partition table entries allows unauthorized modification of boot flow.
How severe is CVE-2026-24090?: CVE-2026-24090 has a CVSS 3.x base score of 7.1, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability none.
Is CVE-2026-24090 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2026-24090?: CVE-2026-24090 primarily affects Qualcomm Snapdragon 460 Mobile Platform Firmware. In total, 217 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2026-24090?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
Does CVE-2026-24090 have an EU (EUVD) identifier?: Yes. CVE-2026-24090 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2026-33847.
When was CVE-2026-24090 published?: CVE-2026-24090 was published on 2026-06-01 and last updated on 2026-06-17.

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2026-bulletin.html

Affected products (217)

cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_4_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_4_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:smart_audio_400_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8845p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8735p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8650q_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8635p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8635_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7675p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7635p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7550p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7550_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7525_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7435p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm6850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:cq8725s_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:cq7790_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:cologne_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8031_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_480_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8850w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8855c_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:x1e80100_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:xrv7209_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:xrv9209_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:cq8750m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Snapdragon 460 Mobile Platform Firmware

CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
CVE-2023-22388 — Critical (CVSS 9.8): Memory Corruption in Multi-mode Call Processor while processing bit mask API.
CVE-2023-33072 — Critical (CVSS 9.3): Memory corruption in Core while processing control functions.
CVE-2023-33030 — Critical (CVSS 9.3): Memory corruption in HLOS while running playready use-case.
CVE-2026-25268 — High (CVSS 8.8): Memory Corruption when processing invalid HT40 channel layouts during dynamic channel switching operations.
CVE-2026-25277 — High (CVSS 8.8): Memory corruption while using Strongbox due to buffer overflow.

All CVEs affecting Qualcomm Snapdragon 460 Mobile Platform Firmware →

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