CVE-2026-25259
CVE-2026-25259 is a high-severity vulnerability in Qualcomm Cologne Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-787.
Key facts
- Severity: High (CVSS 3.x base score 7.8)
- EPSS exploit prediction: 0% (1st percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2026-33824
- Weakness: CWE-787
- Affected product: Qualcomm Cologne Firmware
- Published:
- Last modified:
Description
Memory corruption while processing multiple IOCTL command for escape operations.
Frequently asked questions
- What is CVE-2026-25259?
- Memory corruption while processing multiple IOCTL command for escape operations.
- How severe is CVE-2026-25259?
- CVE-2026-25259 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2026-25259 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2026-25259?
- CVE-2026-25259 primarily affects Qualcomm Cologne Firmware. In total, 42 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2026-25259?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- Does CVE-2026-25259 have an EU (EUVD) identifier?
- Yes. CVE-2026-25259 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2026-33824.
- When was CVE-2026-25259 published?
- CVE-2026-25259 was published on 2026-06-01 and last updated on 2026-06-17.
References
Affected products (42)
- cpe:2.3:o:qualcomm:cologne_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:iqx5121_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:iqx7181_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca0000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm5430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8380xp_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_662_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_ar1_gen_1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2\+_gen_1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2230p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9378c_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8840_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:x2000077_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:x2000086_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:x2000090_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:x2000092_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:x2000094_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:xg101002_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Cologne Firmware
- CVE-2026-25271 — High (CVSS 7.8): Memory Corruption when processing asynchronous input parameters due to improper handling of modified values between…
- CVE-2026-21379 — High (CVSS 7.8): Memory Corruption when allocating memory with sizes that exceed the maximum allowed value.
- CVE-2026-25260 — High (CVSS 7.8): Memory Corruption when accessing shared buffers without validation of concurrent user-mode input modifications.
- CVE-2026-25258 — High (CVSS 7.8): Memory corruption while processing IOCTL calls for escape operations.
- CVE-2025-59606 — High (CVSS 7.8): Memory Corruption when writing to invalid memory locations occurs due to heap memory exhaustion during secure data…
- CVE-2025-59604 — High (CVSS 7.8): Memory Corruption when running a memory copy operation due to invalid writes caused by a null pointer.
All CVEs affecting Qualcomm Cologne Firmware →
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