CVE-2017-18309

CVE-2017-18309 is a high-severity vulnerability in Qualcomm Sd 845 Firmware with a CVSS 3.x base score of 7.1. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-129.

Key facts

Description

A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850.

Frequently asked questions

What is CVE-2017-18309?
A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850.
How severe is CVE-2017-18309?
CVE-2017-18309 has a CVSS 3.x base score of 7.1, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability none.
Is CVE-2017-18309 being actively exploited?
It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (15th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2017-18309?
CVE-2017-18309 primarily affects Qualcomm Sd 845 Firmware. In total, 2 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2017-18309?
Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2017-18309 published?
CVE-2017-18309 was published on 2018-10-26 and last updated on 2026-06-17.

References

Affected products (2)

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