How severe is CVE-2018-11269?

CVE-2018-11269 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2018-11269 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (19th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2018-11269?

CVE-2018-11269 primarily affects Qualcomm Mdm9206 Firmware. In total, 35 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2018-11269?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2018-11269 published?

CVE-2018-11269 was published on 2018-09-20 and last updated on 2026-06-17.

CVE-2018-11269

CVE-2018-11269 is a high-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-129.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 7.2
EPSS exploit prediction: 0% (19th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-129
Affected product: Qualcomm Mdm9206 Firmware
Published: 2018-09-20
Last modified: 2026-06-17

Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.

Frequently asked questions

What is CVE-2018-11269?: In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
How severe is CVE-2018-11269?: CVE-2018-11269 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2018-11269 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (19th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2018-11269?: CVE-2018-11269 primarily affects Qualcomm Mdm9206 Firmware. In total, 35 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2018-11269?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2018-11269 published?: CVE-2018-11269 was published on 2018-09-20 and last updated on 2026-06-17.

References

Affected products (35)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd810_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*

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