How severe is CVE-2024-23352?

CVE-2024-23352 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.

Is CVE-2024-23352 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (27th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2024-23352?

CVE-2024-23352 primarily affects Qualcomm Snapdragon 855+/860 Mobile Platform (sm8150-ac) Firmware. In total, 105 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2024-23352?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

Does CVE-2024-23352 have an EU (EUVD) identifier?

Yes. CVE-2024-23352 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2024-20856.

When was CVE-2024-23352 published?

CVE-2024-23352 was published on 2024-08-05 and last updated on 2026-06-17.

CVE-2024-23352

CVE-2024-23352 is a high-severity vulnerability in Qualcomm Snapdragon 855+/860 Mobile Platform (sm8150-ac) Firmware with a CVSS 3.x base score of 7.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-835.

Key facts

Severity: High (CVSS 3.x base score 7.5)
EPSS exploit prediction: 0% (27th percentile)
Actively exploited: Not listed in CISA KEV
EU (EUVD) id: EUVD-2024-20856
Weakness: CWE-835
Affected product: Qualcomm Snapdragon 855+/860 Mobile Platform (sm8150-ac) Firmware
Published: 2024-08-05
Last modified: 2026-06-17

Description

Transient DOS when NAS receives ODAC criteria of length 1 and type 1 in registration accept OTA.

Frequently asked questions

What is CVE-2024-23352?: Transient DOS when NAS receives ODAC criteria of length 1 and type 1 in registration accept OTA.
How severe is CVE-2024-23352?: CVE-2024-23352 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.
Is CVE-2024-23352 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (27th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2024-23352?: CVE-2024-23352 primarily affects Qualcomm Snapdragon 855+/860 Mobile Platform (sm8150-ac) Firmware. In total, 105 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2024-23352?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
Does CVE-2024-23352 have an EU (EUVD) identifier?: Yes. CVE-2024-23352 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2024-20856.
When was CVE-2024-23352 published?: CVE-2024-23352 was published on 2024-08-05 and last updated on 2026-06-17.

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2024-bulletin.html

Affected products (105)

cpe:2.3:o:qualcomm:snapdragon_855\+\/860_mobile_platform_\(sm8150-ac\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8840_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9395_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9360_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9340_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x75_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x72_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x70_modem-rf_system_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x65_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x62_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_x35_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_gen_2_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_888\+_5g_mobile_platform_\(sm8350-ac\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_888_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_platform_\(sm8250-ac\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_platform_\(sm8250-ab\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_855_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8\+_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8\+_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Snapdragon 855+/860 Mobile Platform (sm8150-ac) Firmware

CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
CVE-2025-21479 — High (CVSS 8.6): Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.
CVE-2025-21480 — High (CVSS 8.6): Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.
CVE-2025-21487 — High (CVSS 8.2): Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is…
CVE-2025-21484 — High (CVSS 8.2): Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments…
CVE-2024-53026 — High (CVSS 8.2): Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call.

All CVEs affecting Qualcomm Snapdragon 855+/860 Mobile Platform (sm8150-ac) Firmware →

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