How severe is CVE-2025-21484?

CVE-2025-21484 has a CVSS 3.x base score of 8.2, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability low.

Is CVE-2025-21484 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (15th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2025-21484?

CVE-2025-21484 primarily affects Qualcomm Sm8750 Firmware. In total, 173 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2025-21484?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

Does CVE-2025-21484 have an EU (EUVD) identifier?

Yes. CVE-2025-21484 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-31000.

When was CVE-2025-21484 published?

CVE-2025-21484 was published on 2025-09-24 and last updated on 2026-06-17.

CVE-2025-21484

CVE-2025-21484 is a high-severity vulnerability in Qualcomm Sm8750 Firmware with a CVSS 3.x base score of 8.2. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-126.

Key facts

Severity: High (CVSS 3.x base score 8.2)
EPSS exploit prediction: 0% (15th percentile)
Actively exploited: Not listed in CISA KEV
EU (EUVD) id: EUVD-2025-31000
Weakness: CWE-126
Affected product: Qualcomm Sm8750 Firmware
Published: 2025-09-24
Last modified: 2026-06-17

Description

Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.

Frequently asked questions

What is CVE-2025-21484?: Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.
How severe is CVE-2025-21484?: CVE-2025-21484 has a CVSS 3.x base score of 8.2, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability low.
Is CVE-2025-21484 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (15th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2025-21484?: CVE-2025-21484 primarily affects Qualcomm Sm8750 Firmware. In total, 173 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2025-21484?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
Does CVE-2025-21484 have an EU (EUVD) identifier?: Yes. CVE-2025-21484 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-31000.
When was CVE-2025-21484 published?: CVE-2025-21484 was published on 2025-09-24 and last updated on 2026-06-17.

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/september-2025-bulletin.html

Affected products (173)

cpe:2.3:o:qualcomm:sm8750_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8850p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:smart_audio_200_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:smart_display_200_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_208_processor_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_210_processor_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_212_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_4_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_429_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_480_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_480\+_5g_mobile_platform_\(sm4350-ac\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_625_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_626_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_660_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_662_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_675_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_678_mobile_platform_\(sm6150-ac\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_platform_\(sm6225-ad\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_690_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_695_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_720g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_730_mobile_platform_\(sm7150-aa\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_730g_mobile_platform_\(sm7150-ab\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_732g_mobile_platform_\(sm7150-ac\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_750g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_765_5g_mobile_platform_\(sm7250-aa\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_765g_5g_mobile_platform_\(sm7250-ab\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_768g_5g_mobile_platform_\(sm7250-ac\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8\+_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_820_automotive_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_835_mobile_pc_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_845_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_855_mobile_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_855\+\/860_mobile_platform_\(sm8150-ac\)_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Sm8750 Firmware

CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
CVE-2025-21450 — Critical (CVSS 9.1): Cryptographic issue occurs due to use of insecure connection method while downloading.
CVE-2025-47345 — High (CVSS 8.4): Cryptographic issue may occur while encrypting license data.
CVE-2024-33056 — High (CVSS 8.4): Memory corruption when allocating and accessing an entry in an SMEM partition continuously.

All CVEs affecting Qualcomm Sm8750 Firmware →

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