CVE-2025-21429
CVE-2025-21429 is a high-severity vulnerability in Qualcomm Sa9000p Firmware with a CVSS 3.x base score of 7.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-126.
Key facts
- Severity: High (CVSS 3.x base score 7.5)
- EPSS exploit prediction: 0% (14th percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2025-10001
- Weakness: CWE-126
- Affected product: Qualcomm Sa9000p Firmware
- Published:
- Last modified:
Description
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
Frequently asked questions
- What is CVE-2025-21429?
- Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
- How severe is CVE-2025-21429?
- CVE-2025-21429 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.
- Is CVE-2025-21429 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (14th percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2025-21429?
- CVE-2025-21429 primarily affects Qualcomm Sa9000p Firmware. In total, 182 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2025-21429?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- Does CVE-2025-21429 have an EU (EUVD) identifier?
- Yes. CVE-2025-21429 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-10001.
- When was CVE-2025-21429 published?
- CVE-2025-21429 was published on 2025-04-07 and last updated on 2026-06-17.
References
Affected products (182)
- cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd626_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd730_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx61_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:smart_audio_200_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:smart_audio_400_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:smart_display_200_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_1200_wearable_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_210_processor_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_212_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_4_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_429_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_480_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_480\+_5g_mobile_platform_\(sm4350-ac\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_625_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_626_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_660_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_662_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_670_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_675_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_678_mobile_platform_\(sm6150-ac\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_platform_\(sm6225-ad\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_695_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_710_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_720g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_730_mobile_platform_\(sm7150-aa\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_730g_mobile_platform_\(sm7150-ab\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_732g_mobile_platform_\(sm7150-ac\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_platform_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Sa9000p Firmware
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2023-43553 — Critical (CVSS 9.8): Memory corruption while parsing beacon/probe response frame when AP sends more supported links in MLIE.
- CVE-2023-43552 — Critical (CVSS 9.8): Memory corruption while processing MBSSID beacon containing several subelement IE.
- CVE-2023-43556 — Critical (CVSS 9.3): Memory corruption in Hypervisor when platform information mentioned is not aligned.
- CVE-2023-43538 — Critical (CVSS 9.3): Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization.
All CVEs affecting Qualcomm Sa9000p Firmware →
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