CVE-2025-21434
CVE-2025-21434 is a high-severity vulnerability in Qualcomm Qcs8300 Firmware with a CVSS 3.x base score of 7.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-126.
Key facts
- Severity: High (CVSS 3.x base score 7.5)
- EPSS exploit prediction: 0% (14th percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2025-9998
- Weakness: CWE-126
- Affected product: Qualcomm Qcs8300 Firmware
- Published:
- Last modified:
Description
Transient DOS may occur while parsing EHT operation IE or EHT capability IE.
Frequently asked questions
- What is CVE-2025-21434?
- Transient DOS may occur while parsing EHT operation IE or EHT capability IE.
- How severe is CVE-2025-21434?
- CVE-2025-21434 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.
- Is CVE-2025-21434 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (14th percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2025-21434?
- CVE-2025-21434 primarily affects Qualcomm Qcs8300 Firmware. In total, 122 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2025-21434?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- Does CVE-2025-21434 have an EU (EUVD) identifier?
- Yes. CVE-2025-21434 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-9998.
- When was CVE-2025-21434 published?
- CVE-2025-21434 was published on 2025-04-07 and last updated on 2026-06-17.
References
Affected products (122)
- cpe:2.3:o:qualcomm:qcs8300_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs9100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qfw7114_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qfw7124_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qmp1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc5_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8530p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8540p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8620p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8650p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8770p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sg8275p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7635_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7675p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8635_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8635p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8650q_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8735_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8750_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8\+_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_ar1_gen_1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_ar1_gen_1_platform_\"luna1\"_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_ar2_gen_1_platform_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Qcs8300 Firmware
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2025-21487 — High (CVSS 8.2): Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is…
- CVE-2025-21427 — High (CVSS 8.2): Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.
- CVE-2024-53026 — High (CVSS 8.2): Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call.
- CVE-2024-53021 — High (CVSS 8.2): Information disclosure may occur while processing goodbye RTCP packet from network.
All CVEs affecting Qualcomm Qcs8300 Firmware →
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