CVE-2025-47317
CVE-2025-47317 is a high-severity vulnerability in Qualcomm Fastconnect 6200 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-126.
Key facts
- Severity: High (CVSS 3.x base score 7.8)
- EPSS exploit prediction: 0% (1st percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2025-30987
- Weakness: CWE-126
- Affected product: Qualcomm Fastconnect 6200 Firmware
- Published:
- Last modified:
Description
Memory corruption due to global buffer overflow when a test command uses an invalid payload type.
Frequently asked questions
- What is CVE-2025-47317?
- Memory corruption due to global buffer overflow when a test command uses an invalid payload type.
- How severe is CVE-2025-47317?
- CVE-2025-47317 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2025-47317 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2025-47317?
- CVE-2025-47317 primarily affects Qualcomm Fastconnect 6200 Firmware. In total, 53 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2025-47317?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- Does CVE-2025-47317 have an EU (EUVD) identifier?
- Yes. CVE-2025-47317 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-30987.
- When was CVE-2025-47317 published?
- CVE-2025-47317 was published on 2025-09-24 and last updated on 2026-06-17.
References
Affected products (53)
- cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcc5161_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcc710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcc711_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcc7225_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcc7226_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcc7228_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qmp1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:s3_gen_2_sound_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:s3_sound_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:s5_gen_2_sound_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:s5_sound_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6475_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6650p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7435_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7550_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7550p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7635_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7635p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7675p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8635_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8635p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8735_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8750_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_6_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9371_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9378_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9395_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6755_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Fastconnect 6200 Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2023-22388 — Critical (CVSS 9.8): Memory Corruption in Multi-mode Call Processor while processing bit mask API.
- CVE-2023-24855 — Critical (CVSS 9.8): Memory corruption in Modem while processing security related configuration before AS Security Exchange.
- CVE-2023-28562 — Critical (CVSS 9.8): Memory corruption while handling payloads from remote ESL.
- CVE-2023-43538 — Critical (CVSS 9.3): Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization.
All CVEs affecting Qualcomm Fastconnect 6200 Firmware →
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