How severe is CVE-2025-59606?

CVE-2025-59606 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2025-59606 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2025-59606?

CVE-2025-59606 primarily affects Qualcomm Cologne Firmware. In total, 141 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2025-59606?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

Does CVE-2025-59606 have an EU (EUVD) identifier?

Yes. CVE-2025-59606 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-210021.

When was CVE-2025-59606 published?

CVE-2025-59606 was published on 2026-06-01 and last updated on 2026-06-17.

CVE-2025-59606

CVE-2025-59606 is a high-severity vulnerability in Qualcomm Cologne Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-476.

Key facts

Severity: High (CVSS 3.x base score 7.8)
EPSS exploit prediction: 0% (1st percentile)
Actively exploited: Not listed in CISA KEV
EU (EUVD) id: EUVD-2025-210021
Weakness: CWE-476
Affected product: Qualcomm Cologne Firmware
Published: 2026-06-01
Last modified: 2026-06-17

Description

Memory Corruption when writing to invalid memory locations occurs due to heap memory exhaustion during secure data initialization.

Frequently asked questions

What is CVE-2025-59606?: Memory Corruption when writing to invalid memory locations occurs due to heap memory exhaustion during secure data initialization.
How severe is CVE-2025-59606?: CVE-2025-59606 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2025-59606 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2025-59606?: CVE-2025-59606 primarily affects Qualcomm Cologne Firmware. In total, 141 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2025-59606?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
Does CVE-2025-59606 have an EU (EUVD) identifier?: Yes. CVE-2025-59606 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2025-210021.
When was CVE-2025-59606 published?: CVE-2025-59606 was published on 2026-06-01 and last updated on 2026-06-17.

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2026-bulletin.html

Affected products (141)

cpe:2.3:o:qualcomm:cologne_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:cq7790_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:cq8725s_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:cq8750m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8840_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8850w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8855c_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:x2000077_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:x2000086_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:x2000090_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:x2000092_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:x2000094_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:xg101002_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:xg101032_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:xg101039_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:xrv7209_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:xrv9209_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:g2_gen_1_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:iq-615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:iq-8275_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:iq-9075_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:lemans_au_lgit_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:lemansau_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:molokai_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:monaco_iot_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:netrani_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:orne_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:palawan25_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pandeiro_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qam8255p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qam8397p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qam8620p_firmware:-:*:*:*:*:*:*:*

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