CVE-2026-25294
CVE-2026-25294 is a high-severity vulnerability in Qualcomm Cologne Firmware with a CVSS 3.x base score of 7.4. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-126.
Key facts
- Severity: High (CVSS 3.x base score 7.4)
- EPSS exploit prediction: 0% (1st percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-126
- Affected product: Qualcomm Cologne Firmware
- Published:
- Last modified:
Description
Transient DOS while parsing frame during channel usage.
Frequently asked questions
- What is CVE-2026-25294?
- Transient DOS while parsing frame during channel usage.
- How severe is CVE-2026-25294?
- CVE-2026-25294 has a CVSS 3.x base score of 7.4, rated high severity. It is exploitable over an adjacent network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.
- Is CVE-2026-25294 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2026-25294?
- CVE-2026-25294 primarily affects Qualcomm Cologne Firmware. In total, 75 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2026-25294?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- When was CVE-2026-25294 published?
- CVE-2026-25294 was published on 2026-09-17 and last updated on 2026-09-22.
References
Affected products (75)
- cpe:2.3:o:qualcomm:cologne_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:congo_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:cq7790_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:cq7790m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:cq8845s_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mbm715_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:orne_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:palawan25_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:pandeiro_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:q-7790_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qln1083bd_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qln1086bd_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qmp1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qmp2001_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qpa1083bd_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qpa1086bd_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_8800_mobile_connectivity_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qxm1093_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qxm1094_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qxm1095_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qxm1096_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8380xp_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4875_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7675_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7675p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7750p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8635_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8635p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8650q_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8735p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8845p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8950p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8975_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Cologne Firmware
- CVE-2026-25289 — Critical (CVSS 9.6): Memory Corruption when processing Device Capability Extended attributes in certain NAN Service Discovery Frames with…
- CVE-2026-25283 — High (CVSS 8.8): Memory Corruption when copying unverified data from an external source exceeds the allocated buffer size.
- CVE-2026-25282 — High (CVSS 7.9): Transient DOS when processing unverified data from a neighboring system causes out of bound memory access.
- CVE-2026-25290 — High (CVSS 7.8): Memory Corruption when validating large data buffers from external sources using addition to check buffer length.
- CVE-2026-25280 — High (CVSS 7.8): Memory corruption when processing escape handling flow with insufficient user buffer sizes.
- CVE-2026-24075 — High (CVSS 7.8): Memory Corruption when multiple threads issue concurrent IOCTL requests to the device control handler due to improper…
All CVEs affecting Qualcomm Cologne Firmware →
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- CVE-2023-51773 — Critical (CVSS 9.1): BACnet Stack before 1.3.2 has a decode function APDU buffer over-read in bacapp_decode_application_data in bacapp.c.
- CVE-2021-34584 — Critical (CVSS 9.1): Crafted web server requests can be utilised to read partial stack or heap memory or may trigger a denial-of- service…
- CVE-2025-36855 — High (CVSS 8.8): A vulnerability ( CVE-2025-21176 https://www.cve.org/CVERecord ) exists in DiaSymReader.dll due to buffer over-read.…
- CVE-2025-21176 — High (CVSS 8.8): .NET, .NET Framework, and Visual Studio Remote Code Execution Vulnerability